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IX-280-C


Ceramic Drilling and Cutting Machine

The IX-280-C is an application-specific configuration of the IX-280 platform that is designed to meet demanding high-precision cutting, scribing and drilling requirements of ceramics and other materials used in microelectronics and specialized semiconductor packaging. The IX-280-C combines the best of IPG’s QCW lasers with precision stage and vision systems to deliver high accuracy and high-speed part processing.